For those interested, here is an excerpt from a DRS paper that discussed the DARPA LCTI project
"Low Cost Thermal Imager –Manufacturing
In 2011, DARPA initiated an uncooled development program aiming at dramatically reducing the uncooled camera size,
weight, and power (SWaP) and production costs. The objectives of the Low Cost Thermal Imager – Manufacturing (LCTIM)
program are:
Develop a cell phone-like miniature uncooled infrared camera with wafer-level processes for chip-scale
manufacturing
Demonstrate a very compact fully integrated thermal camera interfaced to a small handheld platform (e.g. cell
phone).
Key requirements of the LCTI-M Thermal Imager are listed below:
Thermal Imager HFOV: 40 degrees
Range of operation: 75 m (min) and 400 m (max)
Frame Rate: >15 Hz (DRS design includes 30 and 60 Hz)
Power Consumption: 500 mW
Thermal Core Weight: <25 grams
Complete Camera Volume: <3.5 cm3
Cost per Camera (fully functional) <US$500
Format: 640x480
Display: Handheld device
To achieve such ambitious goals, DRS has assembled a team of industrial experts including FiveFocal of Boulder
Colorado, RTI International and MEMSCAP of Research Triangle Park, North Carolina to develop several critical
technologies and manufacturing techniques including small pixel pitch (sub 17 um) VOx microbolometer, advanced digital
readout (ROIC), chip-scale low cost optics, wafer level vacuum packaging (WLVP) and 3-D integrated camera electronics.
Comparison of the LCTI and Tamarisk ®
320 size and key features are shown in Figure 4 and Table 2, respectively. A brief
description of the LCTI-M technical elements and their development status is summarized below. BAE Systems,
Lexington, Massachusetts and Raytheon Vision Systems, Goleta, California are also participants of the DARPA LCTI-M
program."
Fraser