For device info with images see:
http://hdg2002b.simplesite.com/412252681For the soldering basics, watch Dave's video, which includes QFP packages like the DM9000:
Essentially, after fluxing all pins& pads, and tacking 2 opposing pins in place, you can a) flood all pins with solder, then use a broad iron tip over a copper wick, and remove the excess, or b) use a fine chisel pointed tip, apply some solder to the tip, and work 2-3 pins at a time, cleaning the tip to allow surface tension to aid in clean up when pins bridge. Use the tip like a paint brush-like motion pulling way from the pin. I personally used method (a), as it is faster. Be careful with the existing caps near the device; you don't want to shift or bridge them.
If you have access to a temp controlled hot-air gun with a pencil tip, see this video:
Note the paint brush-like motion pulling way from the pin when touching up with a regular iron!
If you think you've screwed up and can't get solder to wick up from behind pins, don't panic!
Add some more solder & Use a broader tip with the wick; a 3mm tip may seem like overkill for method (a), but it works fine. Do not increase the temp. If nothing works, buy some ChipQuick lo-temp rework solder, apply liberally around the entire device. Use a temp-controlled hot air gun to remove the device. You can use a soldering iron if you use a blade tip & move quickly. After removal, clean all pins and pads with the solder wick method. Inspect for bridges. Start over: clean with alcohol, re-flux, solder again.
Tips: Practice!
Buy some cheap AVR/PIC QFP's and some test pcbs to practice. Clean all surfaces with 99% alchohol and kimwipes first, then use non-cleanup flux (chipquick). Do not use needle point tips, as you need consistent heat at the tip; use conical or tapered tips. Temp should be <= 650F, but be sure to keep the tip moving; do not linger. Apply solder to the wick when starting to aid in heat transfer.
Inspect your work with a magnifying glass in bright light, or preferably a bi-ocular microscope with 15-70x mag.
There's no software adjustment required. A kernel module is already present in the bootup sequence. Telnet is mapped to busybox. You could cross-compile other network daemons if you really wanted ssh or other functionality. Keep in mind that aside from a debug interface, there is no other network support for the device at the moment.