I built a cardboard form to try potting the components on the board in hot glue. It is cooling, now.
Here is what I recommend:
1) Lay out the measurements of the box on thin cardboard; 32mmL x 10mmW x 32mmL x 10mmW. Make the fence high enough to cover the components and their bent leads... Mine is 12mmH. These dimensions will change on the new version of the board.
2) Cut the cardboard, vertically, at the vertical points. Do not cut the horizontals, yet.
3) Cover the cardboard with tape that is resistant to the hot glue... Kapton tape would be good.
4) Cut the horizontal line and remove the fence strip from the remaining cardboard. Do not cut the vertical tape joints.
5) Fold the fence strip into a rectangle with the tape to the inside of the fence.
6) Cover the outside of the fence with tape.
7) Secure the fence to the board. The fence will try to float up and allow glue to ooze out the bottom, if you don't secure it well.
8) Make a heat shield to protect the wiring.
9) Heat a stick of hot glue and fill the cavity. I used a heat gun.
You could use proper potting, or some sort of glue, but I did not want to go to that expense, for prototyping.
I can make a drawing, if the instructions are not clear.
EDIT: Things I learned
- Make a dam, out of aluminum foil, and wrap it around the convex end of the IR components, to close the gap between them and the board, to prevent glue from filling their holes.
- Cover the bottom of the board with tape, to protect that surface.
- Make the fence higher than needed, to accommodate shrinkage, due to the cooling of the hot glue.
I have an extra board, if someone would like to:
- Verify the traces
- Verify the fit in the bracket
- Practice potting
I would be glad to mail it to anyone in the USA/Lower48. Just send me a pm with your mailing address.
Please know that the IR component holes are not exactly in the correct spot, so this is not a functional board.