Hi Everyone-- first post here after lurking erratically for years.
Short bio-- Former USAF officer turned mechanical engineer. Have some background in electronics, just enough to sound like a dumb person's idea of a smart guy while looking dumb to the truly smart people. Basically, I know how to break things REALLY WELL. And my postings tend to be long. Sorry, I don't have time to make them shorter.
I took up soldering as a hobby to itself because so many of my other hobbies seem to require it. I'm using an FX-951 as a daily driver as my first "real" station upgrading from the cheap pencils that turn electricity into oxidation and frustration. I don't do a lot of PCB work and do mostly pro-audio, discrete type items. Things with lugs wired together. (vacuum tube sockets, turret boards, 1/4" and XLR cables, replacing switches, sockets, etc.). I've done PCB and I'm comfortable with it, but I'm not experienced with SMD/SMT.
The lack of soldering truly tiny things had me wondering if I couldn't make something like a Hakko FX-801 a one-station solution for me. Something that would do all that I do, but with the hot-rod performance of a 300W cartridge style handpiece. Since I'm a happy 951 user, I requested a Demo unit of the FX-801. It arrived a few weeks ago. I've been using it next to my FX-951 extensively, so what follows is a short review of the 801, contrasting with the 951, and some enlightening observations about using them side by side.
The 801 is impressive when you get it out and set it up. It has the same kind of microswitch stand as the 951. (pretty sure it's actually the same stand, not just the same kind). The housing of the 801 is real sheetmetal and has a flat, ventless top so it will stack. You flip it on and the not-quiet fan will remind you this is probably intended for industrial use and not lab use. It's pretty loud. It comes up to temperature about the same speed as the 951 does (at least with the slim series small chisels I requested). The handpiece is remarkably small and compact in hand given how much power is on tap. In terms of just generally accessibility, I think this could be an iron I could use for almost anything, because the slim series cartridges ("carts") are only 7.2mm diameter. vs the T12/15 diameter of 5.5mm. In practice, you don't much notice the larger diameter. Nor is the slightly longer distance from the grip much of an issue. It's probably a good thing to get the tip a little farther away from the handle when talking about this kind of heat potential. (settings up to 500C).
It has power to spare. Enough to where I basically could never load the tool enough to induce any meaningful tip temperature drop in terms of seeing the display dip below set point. Oh, I can hold it on a wet sponge and get it to drop 80C-100C, but in practical use, it was very difficult to make it drop temp.
But in the course of comparing it to my FX951, I realized I could also almost never get my 951 to show much of a temperature drop. On a wet sponge, absolutely, but in actual soldering, it seemed rock-steady.
So my engineer brain kicks and and starts asking: what kind of thermal load in soldering would actually pull down the temperatures and indicate that the station is completely overwhelmed? I happened to have a scrap of 3/4" copper pipe about a foot long. Knowing how oxidized this pipe was, I had generous amounts of both paste flux and liquid MG835 on ready-five. AHA! THIS is the mother of all heat sinks. All I need to do is try to solder a wire to this pipe and my 951 will come crawling for mercy when the temp drops 100C or more and I will show where the 300w Hakko reins supreme and conquers where the 951 fails. RIGHT?
WRONG. I tried my 951 at 330C. I managed to melt a rather large puddle of solder onto the pipe end, but it wouldn't wet or spread on the pipe on its own, I had to spread it with the iron tip. I had the tip of my 951's 3.2D completely submerged in solder and the station's feedback temperature never dropped below 310C from the 330C setting. Hmm. Clearly I'm not getting enough heat flow out of my tip and it's not because I don't have enough heat sinking occurring. So I crank up the temperature to 370C. The feedback temperature on the 951's display never got below 340C. This, with the tip well submerged in a massive puddle of solder on the end of a large solid copper pipe. (This tip is in excellent condition, it appears new on the tinned area, so it transfers heat as well as it ever could).
Unsurprisingly, the 300w Hakko did not much better at all at identical temperatures of 330C and 370C. I submerged its (larger) tip in a puddle of solder and it still wouldn't drop the feedback temperature very far at all-- less than 10C. It has less drop because it's a lot more powerful.
But why is there so little performance increase between the 951 and 801? This really bothered me. The 801 has much more mass in the tips. It has over 400% of the power of the 951. Yet when you start melting solder with each station, the real world difference between them is tiny at best,
even with brand new tips in immaculate condition.
There's only one logical explanation I can think of, and it's this: the main limit in soldering heat flow is the tip interface and the solder itself. Think about it this way: you have a large section of copper pipe that's fairly massive and conductive. And because it has a large surface area relative to its mass, it will lose a lot of heat. You melt a substantial puddle of solder on one end and submerge the tip of an iron in it. But within the puddle you have temperatures of nearly 350C or so at the tip to barely over 180C at the edges of the puddle. There is a substantial heat gradient.
The gradient exists because heat is flowing in much faster that it's flowing out. But this means that eventually the heat will "pile up" and you'll have very little gradient
at the tip. So heat stops flowing out of the tip. Which means the iron does a lot less work. Which means it doesn't need very much power because it's not drawing much power.
All that to say that I think there is some amount of actual station power such that having more power is totally moot. I am certain the FX-801 is beyond that point. You simply cannot flow that power out of the tip because whatever conduit you've got for the heat flow will not allow a more rapid rate of energy transfer. You get to a point where the iron and station simply aren't the weak link in your process. It's Pareto principle, and your soldering tool is no longer the far left column. Rather, tip geometry and cleanliness, and then ultimately the solder's conductivity and the components specific heat and thermal mass come into play. If a massive puddle of solder on a 12" section of copper pipe isn't enough thermal mass to pull the tip temperature down, then what is?
It's possible then that thermal recovery is a lot less important than we might first have thought. If you have a tiny tip, yes it stores a lot less heat, but it also stinks at transferring heat. So the recovery factor will come in sooner, but ultimately require less power because that small tip simply cannot conduct heat fast enough to tax the station. Likewise, a large tip will store a lot more heat. And it's possible that this stored heat will be sufficient to execute your joint before temperature drops appreciably and--again-- the power of the station ends up rather unimportant.
We're nearing the point that the thermal conductivity of copper itself is one of the main limiting factors to heat throughput. Or perhaps the iron plating on the tip is a big limiting factor. (hence the two different JBC tip series--hot rod thin plating vs industrial thick plating)
This explains why the T12 Clone vs 888 thread
https://www.eevblog.com/forum/reviews/t12-clone-vs-888-practical-test-results/ showed somewhat "meh" results for the "superior" cartridge technology. Now I have some reasons to question that test based on extrapolating from a fake t12 tip to a real t12 tip and from a clone station to a real Hakko. But putting aside those objections, it perfectly plausible to me how it might be that a modern station-- even one with massive power and the latest technology-- could underwhelm.
I think it's just the case the soldering performance now is mostly limited by the solders and tip geometries we use and the iron plating we have to apply to keep our copper tips alive. Heat just wont flow out of the tip as rapidly as we want it to.
So the question of thermal performance of a station or iron really becomes one of sufficiency. Either it has enough performance to do what you want to do, or it will struggle. If only only need to get yourself and your pets somewhere, then a Honda civic is equally capable to a Ford SuperDuty. But only one of those will carry 10 tons. And it turns out that in most of our usage, we simply cannot load the vehicle with 10 tons-- it won't fit, the doors are too small, or it takes too long. There's nothing wrong with buying that huge truck just to use for commuting, but it comes at a cost and might not give much of any benefit in return if you can't exploit all of its capability.