Author Topic: Are "shaped" hot air nozzles good for inital reflow or just removal?  (Read 1167 times)

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Offline MRiddickWTopic starter

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Hi all,

I'm getting ready to make the plunge on a hot air rework station (Quick 861DW). Mostly for general repair/rework, but also for installing two SMD parts onto PCBs for my dad (low qty/year, but just enough to be annoying to solder manually). These ICs will be a TQFP-48 package and an SSOP-28 package. Would it be worth it to get a 10mm x 10mm (NK3125) and a 7.5mm SOP (NK3134) for these, or am I just as well off with using a smaller nozzle and flowing it as shown here?

Thanks!
« Last Edit: December 17, 2020, 07:04:40 pm by MRiddickW »
Altium Designer 20 | EAGLE 7.7
 

Online coromonadalix

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Re: Are "shaped" hot air nozzles good for inital reflow or just removal?
« Reply #1 on: December 17, 2020, 08:23:12 pm »
Having a good paste will help and liquid flux too

I dont see any problems with theses adapters,  in time with experience and practice you'll get tthe gist of it.

The important thing for me, is not to overheat the part(s)
 

Offline S. Petrukhin

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Re: Are "shaped" hot air nozzles good for inital reflow or just removal?
« Reply #2 on: December 20, 2020, 01:53:53 am »
Soldering with hot air without heating the board is not very good - you create thermal stresses because the air takes a long time to melt the solder. TQFP-48 it is easier and faster to solder with a soldering iron, especially with a BCM2 tip.
And sorry for my English.
 


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