Does no-one (else) dob some paste down and then use an iron as they place parts? Not oven involved, no stencil involved, just using paste instead of solder wire.
Have definitely tried this. It was fun and easy, but unless I'm super meticulous, it leaves unflowed solder paste under parts and behind the pins! And instead of applying solder paste, you can just apply flux, alone. Then touch the bare iron to the pins. Unlike solder paste, you can't "miss" or smudge or get unflowed paste anywhere with the flux and iron tip. There are soldering iron tips that are made to hold a big reservoir of solder, so applying paste solder isn't necessary, at all. All you have to do is pick up solder on the tip of the iron as you pick up the next part (or every several parts, as the case may be). Heating the joint with the iron and applying the solder wire directly to the joint may be "textbook," but that textbook was written in the 80's for use with through hole, oxidized parts, and apparently drag-soldering is plain wrong by these rules. When I do SMD soldering, "solder wire" isn't even part of the equation. I could just as well dip the tip into a pot of molten solder or touch a bit of huge 0.062" wire, or I could use the method which I happen to be currently using, which is to pick up solder from my combined cut tape part holder + "solder pickup and tip cleaning station," where I solder lengths of solder wire over a surface of bare FR-4, which collects excess flux and also cleans/rewets the tip at a touch. (If I need to remove excess solder from the tip for a drag-solder operation, I can touch the tip to the fluxy surface to rewet it and jab the iron in the air to fling the excess solder off onto this board, where I can pick up the solder balls, later). Pick up part, pick up more solder as necessary, as soon as part is lined up, jab, jab, jab, done. Same thing as placing paste, but you can't miss.
I hope he has tried a paste dispenser before giving up on the reflow oven (Again this may not be his intention, just my interpretation of his note).
I have used 3ml syringes, and tapered plastic needles, which take less pressure to dispense. Dispensing is not a problem. The problem is that it still doesn't save any time or effort for me, personally. In some cases, I fully agree that it could be preferable to stencil-pasting, particularly for low part counts or smaller boards. And of course for one-offs. But it will still be a fairly rare case where I would rather use any kind of paste solder/reflow vs regular hand-soldering.
I have said it before, and I am pretty sure I will follow though. Next time I order enough boards to justify a stencil, I will leave all multi-leaded IC's off the paste layer, because they are the parts that cause me the most egregious issues with paste/reflow, stencil or by hand.