Hi,
I just got a Quick 861DW and it works like a charm for de-soldering parts with many pins.
Also I soldered my first board with LEDs, a few ICs and some 0603 parts - it works fine.
For soldering I used the biggest nozzle which came with the Quick (about 8mm diameter), so I heated / soldered the whole board (42mmx9mm) almost at once.
I used solder paste with lead (Sn62Pb36Ag2), temperature set to 300 Celsius (572 F), Airflow set to "20".
But as I am a hot air beginner, I am uncertain if these settings (temp & airflow) are good, or if I should e.g. increase temperature, so the solder procedure would be quicker? With 300 C I started with a few cm distance to the board to do some kind of "preheating", then moved the nozzle about 1cm over the parts until the solderpaste melted (it took about 5s).
So if you are a more experienced Quick 861dw owner, it would be interesting if you have some proven settings you could share.
Regards
Markus