By extrapolating from my previous experience, mostly with larger SMD and larger tips, I would suggest you try the T12/15 BCF1.
It looks massive perhaps. But I use even the gigantic 3mm version of this tip with no issue, messing around with SMD caps and resistors down to 0402 even in proportionally tight layouts. I have all the BCF tips for the T12. 1, 2, and 3mm. And I have all of the CF versions for the 888, which go 1, 1.5, 2, 2.5, 3. (And 4mm, if you include the 900M version).
The 1mm versions are cut at closer to 60 degree slant, rather than 45ish of the larger ones. This allows it to slip between the little passives in the picture you posted. It is big enough you should be able to reflow both pads of an 0201 at the same time for removal of a part, if that is necesssary, without using hot air. Again, I'm extrapolating from using a much larger tip for much larger components. In fact, I hardly ever use one of these tips smaller than 2.5mm. This is huge compared to the 1mm tip. It looks like a bull in a china shop, but it's remarkably light on its feet.
I use the 1mm for tacking jumpers, mostly. It is small enough to do this on pretty much the smallest of pitch IC's. It is bulkier than a pointed tip, but it makes it up for the fact you can load it with solder and it's directional, since the face is the only part that is tinned. Briefly touching kynar or enamel wires with the back or higher up on the shaft won't leave solder blobs on the insulation. If you're quick and light, you won't melt the insulation. And you won't reflow the adjoining fly wire, because the heat transfer is so low/slow devoid of a solder bead/bridge. And prefluxing the board is all that you need to do to get the right amount of solder on the joint.
In my mind, I see why you want the tiny hook to get into tight spots. I think the 1mm bevel tip will do the solderwicking of tiny BGA's, too. The width is probably similar to what the baby hook will be on its side. I have all the bent tips and I find they are not particularly efficient at heat transfer compared to bevels. In fact, I have never found a single occasion to use a BR, other than playing with it. There is nowhere I have found any of them to be specifically useful or even generally handy.
The baby knife tips look the most interesting/useful to me, personally. The nice thing about the knife is that you can get it on both pads of a passive without any solder blob on there, at all, for removal of the part. Mostly this only matter for batch/production rework, though. You can remove a ton of SMD passives without having to wipe off and retin the tip, using the knife.
Even if this doesn't do the trick for you, I would suggest you try it, for the pittance it costs. These TFO bevel tips are a game changer. They are also the best drag soldering tips made, IMO.
I bet they do a heck a lot more cell phone repair in China than here, and if these J30 tips were much better, I think they would be cloned by now.