Since I'm replacing TOP254PN with TOP258PN, I need some help. The specs of these two IC are almost the same, except higher wattage for TOP258PN vs TOP254PN and Rds on of 1.7 ohm for TOP258PN vs 5.4 ohm for TOP254PN.
Now on page 10 of the datasheet
https://www.mouser.in/datasheet/2/328/tophx_family_datasheet-1511305.pdf for these IC, it says
On-Chip Current Limit with External Programmability
The cycle-by-cycle peak drain current limit circuit uses the output MOSFET ON-resistance as a sense resistor. A current limit comparator compares the output MOSFET on-state drain to source voltage VDS(ON) with a threshold voltage. High drain current causes VDS(ON) to exceed the threshold voltage and turns the output MOSFET off until the start of the next clock cycle. The current limit comparator threshold voltage is temperature compensated to minimize the variation of the current limit due to temperature related changes in RDS(ON) of the output MOSFET. The default current limit of TOPSwitch-HX is preset internally. However, with a resistor connected between EXTERNAL CURRENT LIMIT (X) pin (Y, E/L and M packages) or MULTI- FUNCTION (M) pin (P and G package) and SOURCE pin (for TOP259-261 Y, the X pin is connected to the SIGNAL GROUND (G) pin), current limit can be programmed externally to a lower level between 30% and 100% of the default current limit. By setting current limit low, a larger TOPSwitch-HX than necessary for the power required can be used to take advantage of the lower RDS(ON) for higher efficiency/smaller heat sinking requirements.
Now on page 19 of the datasheet, it illustrates how to use a resistor between the pin M and pin S to limit the current (i have attached the illustration as attachment 1). Now to limit the drain current of TOP258 to be the same as TOP254, I have to limit that to 33%. To do that I have to refer to Figure 55b on page which roughly puts 21K resistor between pin M and S. I have attached the figure as attachment 2.
On page 31 of the datasheet for Design checklist, it always says one can put a resistor between the drain and the source pin to limit the resistance. This is what is exactly quoted
Thermal check – At maximum output power, both minimum and maximum voltage and ambient temperature; verify that temperature specifications are not exceeded for TOPSwitch-HX, transformer, output diodes and output capacitors. Enough thermal margin should be allowed for the part-to-part variation of the RDS(ON) of TOPSwitch-HX, as specified in the data sheet. The margin required can either be calculated from the values in the parameter table or it can be accounted for by connecting an external resistance in series with the DRAIN pin and attached to the same heat sink, having a resistance value that is equal to the difference between the measured RDS(ON) of the device under test and the worst case maximum specification.
So as per my understanding, there are two ways to replace TOP258PN with TOP254PN.
1) Put a resistance between Pin D and Pin S to account for the difference between the Rds on of the two ICs. The difference is 5.4 - 1.7 = 3.7 ohms. My reasoning is that this will require me to put high wattage resistors.
2) Put a resistor between Pin M and Pin S and that will automatically limit the drain current to 33% of the typical drain current of TOP258. This allows one to use a higher capacity IC and lowers the heat sink requirement. I find this method better than 1) above as I can use ordinary resistor around 21K to limit the current to 33%. I already have a 22K resistor.
Little knowledge can be dangerous. I'm suspecting that could be the thing that will vapourise the yamaha power board when I replace TOP254PN with TOP258PN. Unfortunately TOP254PN isn't available here in India / lead time to order it is too long. Let me know if I'm on the wrong path.