Reflow advice

[dobsonr741]

I making a single PCB, experimenting with hot plate reflow on an ET-10, and placed and reflowed about half of the components. I used SAC305 mixed with flux, as I do not use a stencil. All components on a single side.

Now it’s time to place the 2nd half of components, I can choose to do it again with SAC305 or I can use low temp solder. Anyone aware any risk going to 240C degree again witch SAC?

No irreplaceable components are on the board, just some analog parts with passives.