If you can keep the board vertical, I would recommend a large passive aluminium heatsink instead of a fan, shaped into an L, so it'd reach the three mounting holes, with heatsink fins also vertical. I don't know the exact dimensions between the three holes, but I can find 100mm × 100mm × 18mm heatsinks on eBay for under 5€. Drill the mounting holes for the heatsink, create board standoffs (cylindrical parts the same height as the processor IC [plus 80% of the thermal pad] is from the board) using a 3D printer or from suitable silicone or PVC tubing (hose), and use a ~1mm thick thermal pad between the heatsink and the fan to allow for slight misalignment between the two.
For even better results, lap the surface of the heatsink using 120 to 360 grit sandpaper on top of a mirror (so it'll be dead flat), and use a grain of rice -sized dollop of thermal compound between the IC and the heatsink, and plastic washers, springs, whatever to make the three standoffs perfect height. The thermal compound is not intended to form a layer per se, just fill in any microscopic voids between the two to maximize the thermal contact surface. (It will look like a continuous layer, though, when taken off.)
If you can take a picture from straight above (perpendicular to the surface), with a ruler in the same view (so I can see approximate dimensions), and measure the distances between the three or four mounting holes, I can make a more detailed suggested design for you.
Disclaimer: I'm not an EE, I'm just a hobbyist myself, but I do this kind of stuff regularly with my own SBCs (single board computers running Linux).