We were doing first run assembly of my ARM board and have a 441 ball 0.8mm pitch Processor (AllWinner A20). We had to go from circle to square aperture on the stencil to get consistent and non-removing balls on the BGA. So with a new setup, we take the board under xray to validate the BGAs and promptly freaked out a little. Solder bridges everywhere. Or where there... We angled the xray (just 2d capable) and see the "solder bridges" climb just like the decoupling caps in the image. So this is inside the chip. Putting non-mounted extra chips in the xray confirms it. I should note that this is a single component side board, i.e. nothing on the back side to ghost the xray.
Xray image
Highlighted "solder bridges" that are embedded components
Is this fairly common to embed components at the pad level in a package? It was a surprise to the production engineer at our assembler. I need to look at the pinouts and see if these are embedded decoupling caps or possibly series termination resistors to control edge speed. The large ones look like 0402 sized packages. But some are down 1/2 or 1/4 that size.