Hi,
New to the forum but been a lurker for a little while.
I'm starting a project that will use mostly thru-hole chips and components. There's one SRAM chip that I can't get in DIP form so decided to design a small PCB to convert from TSOP-II 44 to a DIP configuration so that I can prototype with it, either on breadboards or stripboard/veroboard. I also thought it might be a good first PCB to get manufactured by JLCPCB for a couple of dollars.
I feel silly asking as it's so simple but I was wondering if you could critique it, and let me know if I've made any blunders; in particular I've had to use vias to route the traces underneath the board to keep the overall size down. I also took the liberty of putting 0603 bypass caps across the VCC/GND pins for the particular chip (Cypress CY7C1020CV33) to reduce clutter on the breadboard, but these are optional if another TSOP II sized chip needed to be converted at another time.
Images attached - top, bottom and combined from EasyEDA.
Thanks!