As already mentioned gold in a solder joint is not a good thing, some of the gold from the pad gets dissolved into the solder during liquidus.
This mixing of gold into the solder makes et more brittle, there by increasing the probability for broken solder joints
for a typical ENIG surface the gold layer is between 4um and 6 um thick, and the amount of gold dissolved into the solder joint is very small, this does not really weaken the joint much, but if you add gold to just around 10 - 12 um then you have enough gold in the mixture to have a severely weakened solder joint. (luckily gold is expensive and PCB manufactures keep the layers as thin as possible)
so don't solder on galvanic gold this kind of pads are for edge connectors and spring connections only.
I have been involved with a compagny where running 5-20 million PCB's trough the solder oven was the norm. and they always used OSP (organic surface protection) this was the only thing that could keep the BGA's from popping of the PCB when some stress was introduced into the PCB
HASL was not an option due to all the BGA components, some even stacked - big problems with co-planarity of the HASL surface
so for general Electronics stuff, where the chassis of the equipment can keep stress away from the PCB then ENIG is a reasonable bet, with HASL also ok if you don't have to place parts with co-planarity issues.
If you can handle OSP, then go for it, but be aware of the demands regarding shelf life and humidity.
for production runs, don't go to cheap on the PCB manufacturer field failures are much more expensive