So I'm trying to put together an STM32H7B0 (280MHz CPU, fast GPIO, but minimal flash) with a couple of hyperbus parts (one flash, one RAM). I've been reading the recommendations
from Infineon about their parts and it has a nice layout where everything stays on the top-layer and all is sweetness and light.
ST, not so much...
One of Infineon's recommendations is that CK and CK# differ in length by +/- 10 mils - which is about one of the squares on that image, but CK# and CK are on different sides of the chip! Couple that with data lines that criss-cross and ... yeah.
So I do have layers. The Infineon recommendations are that if you use vias on any DQ* line, use them on all the DQ* lines. I could see this working if I use different layers handle the criss-crossing of signals and avoid routing DQ* on the top layer at all. Before I dive into doing that, anyone got any better ideas ?
Full transparency - there are other balls for some of these signals, and it may be possible to get them closer together, but if you want to use the LTDC and SDMMC as well, this seems to severely restrict the layout.