Author Topic: Reliability vs Lead-less IC packages  (Read 277 times)

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Offline RogerThatTopic starter

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Reliability vs Lead-less IC packages
« on: August 14, 2024, 06:57:12 am »
Hi everyone,

Some years ago I investigate this and the consensus was that leaded parts (TQFP, SOT-23 etc) was considered more reliable than lead-less(DFN,VQFN etc). The application is/was for harsh enviroment: vibration, hot/cold, moisture etc.

I'm now researching new parts for the next project and I'm seeing lead-less parts being advertised as "high reliability for harsh enviroment", mainly DFN discrete transistors.

Has there been any new research showing that lead-less parts are equal or surpassing leaded parts for reliability?

 

Offline RogerThatTopic starter

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Re: Reliability vs Lead-less IC packages
« Reply #1 on: August 30, 2024, 09:52:23 am »
According to a Vishay's DNF soldering guide it is possible to achieve up to 5000 cycles now(link below). Still a bit short of the +10000 cycles for leaded parts.
https://www.vishay.com/docs/86198/sold_rec_for_dfn_packages.pdf
 


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