I have made some circuit boards for household appliances that have been third party tested for CE compliance. The EN60335 standard for household appliances points towards some other, more specific standards about isolation, EMC etc. Then you might have product or country specific addendums on top of that.
2 layer PCB
230/400Vac, 3 phase and PE
PCB inside a IPX5 rated box, pollution degree II
Functional insulation, 2.5 mm, between L1, L2, L3 and N
Basic insulation, 2.5 mm, between PE and all of L1, L2, L3 and N
Traditional 50 Hz transformer and 12Vdc SELV on the secondary side, reinforced insulation. Transformer specified and tested to 4 kV between the primary and secondary windings.
Creepage distance between primary and secondary on FR4 laminate was set to just over 5 mm. I can not remember if we specified the CTI value of the FR4 laminate.
4 layer PCB
Frequency inverter
230 Vac, PE input
PCB inside a IPX5 rated box, pollution degree II
PFC with stepup to a bit over 400 Volts DC, the PCB was designed to handle 500 Volts.
Problem areas:
Heatsink at PE potential fixed with metal screws through the PCB
MOSFET drivers with bootstrap capacitors and a diode. SO16W packages and only 2 NC pins bridging 400V+
SMD ceramic snubber capacitors on the MOSFETs. SMD because of the layer stackup with GND+GND+GND+400Vdc
Three output phases with 400V AC
Phase voltage feedback to a CPU PCB at GND and +5V. Several 1206 resistors in series to handle voltage rating and creepage
Current feedback with Allegro ACS712 in SO8 packages (2.5kV insulation)
The grounding solution made us insulate the external control signals with optocouplers
L-N, functional insulation, 2.5 mm
L and N to PE, basic insulation, 2.5 mm
Output phase to output phase, approx 4 mm
Generally I used just over 4 mm and some problem areas were treated with conformal coating after soldering. The board itself used 70 um base copper without extra plating and our board supplier did not recommend us to combine that together with tougher CTI specifications.
To handle the event of PCB delamination, the layer to layer creepage was measured as: Copper->hole/edge, thickness = 0, hole/edge->Copper
Don't just enter these numbers into the DRC and hope for the best. Do check which standards and addendums that apply for your product! In one of the addendums we had, there was a paragraph that read something like this: "Take the creepage from the next higher voltage class in table YY and then add X mm to adjust for mass volume production".
Regarding certification body testing, make sure that you are prepared and have done your home work. By selecting components, like plastic film capacitors, connectors etc, that already have been tested in some way helps a lot. Glow wire ignition tests takes time and had to be done on components without a trusted test certificate. UL and VDE have online databases listing components and manufacturers with valid test reports. Whatever you do, do not trust any chinese supplier as they tend to "borrow" test reports from each other. Always double check test reports that you get from a supplier.
Panasonic did not want to release anything more than the datasheet for their ECQUL X2 capacitors. The datasheet claimed that they will not burn, but without any reference to UL 94 V0 or something similar.