Some acid is welcome, to dissolve surface oxides, counter water hardness if applicable, and ensure the salt fully dissolves (most non-alkali salts leave some hydroxide precipitate on dissolving, as they prefer a lower pH).
Also make sure the surface is clean -- use a detergent to remove dirt and oils, and solvent and clean wipes to further remove oils. If it's rusty or corroded, soak in something suitable first (e.g. evaporust?), or mechanically prepare it (sand off the crud).
Plain steel can be plated easily enough, though the finish is rather weak without proper preparation and bath formulation. Wipe-on may still be good enough for soldering purposes. I'm not sure that it actually matters, when a fresh iron surface is also tinnable with rosin flux -- it goes a bit slower, but still isn't as bad as trying to solder nickel plating, let alone stainless.
Stainless and tungsten are quite different fish kettles. Stainless is protected with a layer of chrome oxide, which needs to be etched away with a strong enough acid. The stronger reducing environment (Cr metal fraction) may plate Cu too aggressively, giving a flaky deposit, I don't know. Tungsten, I'm not sure how much and in what ways it oxidizes in air at low temps (it does make WO3 at higher temps), but I imagine it's hard to tin, and may be better with a plating process, or series of platings, to get a secure bond.
There are copper-impregnated tungsten brush materials, which may prove helpful as well.
Tim