Speaking of supply etc., has any effort yet been put into BOM minmisation?
Do you mean the last 2 pages on timb's schematic here:
Here's the updated schematic:
http://timb.us/PDF/Scope_Pong_20170406.pdf
Edit: Fixed link to schematic.
Seems like there may be some scope for optimisation - just looking at the BOM list
33 different resistor values
100uf 16v and 25v
two different types of 10u 25V
One 10u is a bi-polar AE Cap, the other is just a standard polarized one used in several places. I could put two standard ones back to back I guess, but I never liked doing that.
The 100uF 16V is Tantalum and *has* to be Tantalum because it's used in an Integrator, so low leakage is needed. The 25V one is used in two places on the power supply: 1) For ripple reduction on the base bias resistors; 2) As bulk decoupling on the output. Now, I *could* up the 16V Tantalum to 25V and use it all three places, but it would be a lot more expensive. The Tantalum is like $1 vs $0.33 for the AE cap, so I think it's better off having two separate types.
Edit: The 100u cap on the base bias resistors could be reduced to 10u, however output ripple will increase from about 500uV to around 5mv (at a 200mA load).
The output cap may be able to be reduced as well, as we'll have additional (optional) bulk decoupling down the line, however I specced 100uF to be safe until I test an actual finished board.
(By the way, when you look at my schematic, if you zoom in you can see a label to the top right of any non-ceramic cap that tells you what it is; AE for Aluminum Electrolytic, Tant for Tantalum, Film for Metalized Polypropylene Film, etc.)