Hello,
I'm new to high-speed layout. Have been doing my best to learn.
What's the general recommendation when routing say a USB 3.0 signal between two SMD pads?
A) Route signal on the top layer, so no via transitions. But is microstrip so only shielded from below.
- I guess, this has better signal integrity but worse EMI/EMC susceptibility.
B) Route signal on an internal layer, 2x via transitions. But now stripline, so the signal is shielded by ground planes above and below.
- I guess this has worse signal integrity, but better EMI/EMC susceptibility
I have a network-router-type project.
I'm unsure what option would be better? Generally or perhaps for my use case.
I don't think we would have any unusual noise sources, this is a general consumer product.
Thanks : )