Two of the chips are SOICs, so you can easily lift individual pins. Remove as much solder as possible with desolder braid then lift the pin with a mounted needle while heating it. I always like to slip a sliver of Kapton sheet or waxed paper under the pin to confirm there aren't any solder whiskers maintaining contact so I don't have to lift the pin high enough for visual inspection of the gap.
Don't forget to bend the pin back down before resoldering it after you are done testing.