Another recommendation for insulating the FETs. That is a difficult heatsink design to use anywhere. The fins are too close for efficient use for external convection cooling, and for internal use, the air has to be forced through the fins - it will go around the heatsink if it can.
So you will probably have to add extra metal around the heatsink to channel the air and then add 3 or 4 small fans to push the air through. Without a well designed air flow through the fins, that heatsink will not be great at all for continuous use. For decent cooling, you need enough air flow to make the air coming out of the box no more then about 20 or 30 degrees above ambient. Less is even better. If it is coming out at 60 degrees above ambient, then you are wasting most of your heatsink.
To insulate the assembly, it would have to be mounted very solidly to the chassis. You can get plastics blocks from a good plastic supplier that can handle the heat (like delrin or laminated bakelite) and it can be drilled and threaded for bolts quite easily. You do have to think towards a heavy duty construction.
With 3 parallel FETs and your requirement of no FET insulators, I just wonder if you are trying to get rid of too much heat using a heatsink not purpose designed for fan cooling. Have you calculated the thermal difference between the first and the last FET?
Richard.