Impact of specifying IPC-A-610 on fabrication notes?

[Pack34]

I've had issues in the past due to poor connections on SMD pads. Mostly with connectors. This is to the point where I'm looking at switching board houses.

Now, with a test-run I had to add some additional solder to one of the connectors and requested moving from a 4mil stencil to a 6mil.

I've been told by a colleague that I should be looking at specifying IPC-A-610 to ensure that assembly meets proper QA standards.

Since the allotment of solder paste is determined by the stencil thickness, which is determined by the smallest feature size on the PCB. What would change in the assembly process by specifying this IPC standard? Is it just added cost to have someone who's completed the coarse to sign-off on it? Or are there actual process and assembly changes made by specifying this?

[Gibson486]

Depends where you get the work done. Most of the quick turn assembly places I know will just use IPC class 2 standards (which is what the a majority of the people want) unless you say not too. It is just cheaper for them to assume and it is in their workflow so deviating from it will cause more money and harm. So, to answer your question, it probably will not make that big of a difference unless the shop you use does not pride themselves in high quality standards. In most cases, if you put something in your notes that conflicts, they will ask you about it.

If you use a big shop, I can see how they would want to use class 1 standards. In that case, those notes matter a lot.