The toshiba part seems to be made for linear operation.
The SOA in the Onsemi parts is likely just calculated from the thermal transients.
The same problem happens with some MOSFET SOA curves. Derive the maximum power for a given pulse length from transient thermal resistance and
than get a useless SOA curve that misses the important part (possible thermal instability / 2nd break-down).
I've heard this paranoia before, but never any justification for it.
Do you know of any evidence to support the claim that an SOA might be calculated without taking instability into account?
How can you tell when one is calculated, and another is legitimate?
Or put another way -- should one put blind trust in the marketing blurb that e.g. "Linear L2" MOSFETs are, in fact, suitable for linear operation? How much veracity does that claim carry, versus a Superjunction MOSFET, or IGBT, that doesn't make such a statement but carries an identical(ly shaped) SOA?
I've certainly been burned by marketing claims before (granted, mostly on much more complicated things -- ICs), and a lack of reading the fine print, the data tables, the characteristic curves. I've not seen a scenario yet where the inverse is true -- but that doesn't mean they don't exist, and I would be very interested to see counterexamples.
With a more normal IGBT a SOA curve without that extra limitation is more like a red flag indicating non trustworthy SOA curve.
So I consider the 2 onsemi part no better than the typical IGBTs, just a worse data-sheet.
So you categorically deny that they might have wide SOA? Why do you know this with such certainty---you must have proof to this effect? Is it a fundamental semiconductor issue, are there journal articles discussing this? (I admit I haven't searched journals for IGBT SOA before.) Is it proven that hotspotting can occur from the resistance of the die thickness itself, thus independent of mounting plate resistance? Could it occur at multiple points simultaneously, or even individual cells, rather than a mass effect biased towards the center of the die (as is widely documented to happen with BJTs and MOSFETs)?
Or perhaps it's much more mundane than this -- you simply asked an FAE and they said yeah it's full of shit. Could you quote the e-mail so we can name-and-shame?
Tim