Seems reasonable...
I would make these changes:
- Traces between SOIC pads are undesirable, because they screw up AOI (automated optical inspection) -- looks like shorts. Even though they're supposed to be shorted, that's the point, but yeah. Not that that matters any for hand assembly, just good practice.
- There are only three vias/through pads connecting the top and bottom ground fills. While that's probably fine for something so small, I like to put vias in all ends/peninsulas and corners to better marry the two together. Again probably doesn't matter here, given the small size, but it's a good practice.
Tim