Hi,
I am currently designing a board for a display that includes SDRAM, NOR flash, ethernet, USB,...
The board should "stick" on the back of the LCD panel, therefore I have to put all components
on the top layer.
I have positioned the caps on the outside of the BGA package and now I need some help
to determine which wiring strategy is better or which one is a no go.
Stackup: #1 High Speed, #2 GND Plane, #3 & #4 Low Speed, #5 Supply Plane, #6 High Speed
1. Using solid supply plane
2. Supply plane with keepout area and track for every supply pin
Is the first one bad for decoupling behaviour?
Does the second one need a GND plane in between to keep the impendance
of the tracks on layer #6?
BR Martin