LQFP100 0.5mm pitch solder mask

[0xdeadbeef]

For my current project, I want to use an LQFP100 with 0.5mm pitch. So even if I reduce the pad width to 0.25mm, the space between the pads is just 0.25mm. As the solder mask swell is usually around 0.1mm, this leaves less than 0,1mm between the pads. Even if I'd reduce the solder mask swell to 0.075mm, the space between the pads would be only 0.1mm. I kinda doubt this is enough for the typical solder mask process to produce a reliable bridge between the pads.
So would it be better to refrain from solder mask between the pads in this case? Or is 0.1mm usually enough?
I'd like to use Jackaltac to produce the PCBs btw.

[0xdeadbeef]

For the sake of completeness, I'll answer myself.
Got a reply from Jacktaltac:
"... the minimum bridge of solder mask is around 3 mil (0.076 mm) so your  0.1 is ample"

[colotron]

I guess it depends on the manufacturer, his equipment and processes.
In my country most of the local pcb manufacturers (the ones that work with low quantities) can't do a solder mask dam smaller than 6 mils.
Also check with your manufacturer things like drill/via sizes (not all sizes are available), min. annular ring, via tenting, routing/and any other assumption you have made to design the pcb.