DC to DC buck converter 4layer layout

[geot51]

Hello,
I'm designing an IoT board which consists of a DC to DC step down converter.
I'm a little confused about the right way to place the via in the output stage for power delivering.
I'm using the TI's TPS54340 IC.

To be more exact.
Datasheet is quite clear about the proper layout.
But I always wondered, how and where should I place the via in the output stage if I want to deliver
the power through an inner layer?

I upload a photo about my two thoughts about this.
The plan A shows the way I choose, but I'm not sure if this is the right way.
Will the extra vias the Plan A has cause a problem?
Should I take the power from the spot after output capacitor?

EDIT: my second picture is my layout in which the inner layers (power plane and ground plane) are not shown.
Also it is not the final design cause many grounds are missing, it's just a draft but I upload it to show how I placed the vias in the output stage.