« previous next »
Pages: [1]   Go Down

Author Topic: DIP SMT package  (Read 794 times)

0 Members and 1 Guest are viewing this topic.

Offline Alex EisenhutTopic starter

  • Super Contributor
  • ***
  • Posts: 3374
  • Country: ca
  • Place text here.
DIP SMT package
« on: May 23, 2019, 11:38:33 pm »
Using the LOC112S

https://www.digikey.ca/product-detail/en/ixys-integrated-circuits-division/LOC112S/LOC112S-ND/654965

It is basically a DIP8 with the leads splayed out and clipped.

Here's my question, given the large size and weight of the chip, will the tiny SMT pads recommended have enough surface tension force to pull the package straight at reflow?
Logged
Hoarder of 8-bit Commodore relics and 1960s Tektronix 500-series stuff. Unconventional interior decorator.
 

Offline T3sl4co1l

  • Super Contributor
  • ***
  • Posts: 21972
  • Country: us
  • Expert, Analog Electronics, PCB Layout, EMC
    • Seven Transistor Labs
Re: DIP SMT package
« Reply #1 on: May 24, 2019, 07:43:33 am »
Parts about 1206 and larger, the package weight tends to dominate over surface tension.

Basically, place it right the first time. ;D

Tim
Logged
Seven Transistor Labs, LLC
Electronic design, from concept to prototype.
Bringing a project to life?  Send me a message!
 
Pages: [1]   Go Up
« previous next »

Share me

Digg  Facebook  SlashDot  Delicious  Technorati  Twitter  Google  Yahoo
Smf

 


EEVblog Main Site EEVblog on Youtube EEVblog on Twitter EEVblog on Facebook EEVblog on Odysee