As I'm currently trying to build something with interlocks that may shift during transport, I've been wondering how else one might assist in overcoming the solder joints fatiguing on the board level other than making the holes tighter and the pads wider?
This is also a common failure mode in 1990's automotive stuff where the pads lift / tear or fatigue a ring and the components completly drop out,
(they will be hot-snotted, but it still has some give)