Advice on making a SON-8 to DIP board

[DrG]

I have started to investigate an RV-3028-C7 RTC. My first impressions are that it looks pretty good, but that is not the question/issue.

I am considering making a SIMPLE breakout (to DIP) board for the chip. I have never made a board before or, more accurately, not a board like this. Yes, many years ago, I etched a few board using pens and decals and ferric chloride.

I have soldered SMTs to DIP breakouts before using an iron and dragging. A TSSOP24 is probably the most “delicate” that I have done. I have a hot air capability on my station.

I am using an old version of Eagle (and do not want to go to diptrace or anything else unless absolutely necessary).

Here, specifically is what I want to accomplish:



That simple breakout is part of their evaluation board. https://www.microcrystal.com/fileadmin/Media/Products/RTC/Demoboard/RV-3028-C7_Demo-Board.pdf All I want is that portion and I started to figure out how to make pads in Eagle and then I started to wonder how I would solder the chip, IF I made such a board.

I do have some Chipquick solder and flux with a syringe.

Do I simply apply the solder (I have no stencil) and hit it with a hot air gun? Obviously, I am not going to be directly on the pads. Would that work? That, in general, is my question.

I also add that I am aware of one SON-8 to DIP board (actually they have two versions).  https://www.icbreakout.com/collections/breakout-boards-son-small-outline-no-lead/products/son-8-breakout-board-3x2-mm-0-5-mm It might work but I don’t think that the measurements are exactly as in the recommended layout, but close. https://cdn.shopify.com/s/files/1/1690/2801/files/ICB00160_Dimensions.pdf?1137012631354654133 Would it just not be worth the effort to make a whole board if that would fit the bill (the cap is a bypass and could be elswhere close to the chip)?

Here is the recommended pad layout https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-8803-C7.pdf

Anyone have some guidance/ advice?