I just received a small batch of prototype boards from a PCB assembler. The PCBs were SMD populated and as there were not many through hole components I was going to fit those devices.
When inspecting the build quality, I noticed that there were small balls of solder under many of the components. It was most noticeable under a series of MELF resistors, but there were some visible at the edge of some 2512 components as well.
When I spoke to the assembler, there comment was "Oh this always happens with those devices, it's industry standard". My question is, is this true?
If it is then I am rather worried as the clearance over the MELF resistors is critical - any solder balls would reduce the clearance and I could have some serious issues.
I have checked the data sheet for the resistors and the footprint seems correct. The only thing I am not so sure of is the resistors could get quite warm so there is a reasonable amount of copper around the pads to help get rid of the heat. The 2512 component footprint is as on the datasheet.
Neil