You made me lough.
If i made you lough i won!
http://www.thefreedictionary.com/loughThey do incorporate chips with hundreds of pins.
The point was fewer pins not hundreds of balls!
EDIT: BTW they do have billions of transistors on the die. https://venturebeat.com/2017/01/03/qualcomms-snapdragon-835-will-debut-with-3-billion-transistors-and-a-10nm-manufacturing-process/
That just screams OEM and NDA and million volumes and 8 layer PCB, no thanks, i want 1Ghz,32Bit, 4MB SRAM TSSOP20.
Why is it so that larger the Flash/SRAM are the more pins a device get?! Surely there are very little die size difference between 32k and 64k for any same given 64TQFP package etc. Thats also like number of pins irrational and foolish marketing strategy.
Yet ST makes QFP32/TQFP48/TSSOP20 "market correct" packages utterly wrong according to some folks reasoning here.
No point getting upset. It's the simply the market, if there was a ready market for the size/pin count you want then i'm sure (bounded by the laws of physics etc..) that someone would be making it. Most IC's these days are designed for a lead customer (automotive/consumer/perhaps industrial sometimes).
Im not upset, its some of the log conservative thinking engineers in this thread thats upset over the idea of 1Ghz 32bit 1MB SRAM TSSOP20. Speaking of the market i bet nobody understands ST market approach with their line of MCU's that make no sense anymore , very few would be able to select the "right device" for their product based on price reasons or peripherals it barely make sense in volumes.
I recently read that on a new car these days 73% of its price are electronics/software rest is metal. So what MCU and car manufacturer do is to "invent a problem" as an excuse to invent a solution to that problem, yet car manufacturers overproduce cars.
In those cases you don't use SO packages as it'a a waste of space by itself. Large package that could fit only a tiny die inside of it.
I'm talking about pin count, glad you confirms die size so make it BGA8, 1mm by 1mm.
And in such case 1 layer PCB would be inadequate even by signal integrity standpoint. No it would not be splendid. It would be
a bulky piece of crap which you could put on tiny multilayer board instead. And you don't put WLCSP10 on a cheap single layer board.
Nope it would be elegant, tiny utterly cheap and cost effective compared to your 8 layer 1million balls solution not even mention how
impossible it would be to sell it for 15 usd. But heey, "money" is an artificial figure at the end of the day.