Hello,
What if you were to average the four references? Have you considered that?
no definitively not. I´ll keep only the best for precision measurements.
1) I've heard that bee's wax has remarkably good moisture properties. Perhaps bake the board and dip coat it in molten bee's wax, maybe a couple coats. It worked for resistors and such in the old days.
The LS8 package is insensitive to humidity.
And at least ADC21 + ADC22 (dead bug mounted) have no influence from PCB epoxy.
ADC22 shows a direction change + large increase of drift to 8ppm/kHr.
ADC23 is nearly unimpressed by the treatment.
Well, ADC22 is dead bug mounted and ADC23 is the slotted pcb. Up to now I was believing dead bug is better, but this latest test now shows a different picture. Any ideas of interpretation of this results available?
Are you planing a similar test with ADC21 (dead bug) and ADC24 (slotted pcb) as a cross comparison?
at the moment the humidity (in winter) is near constantly low at 50% rF here.
So what I see as drift has nothing to do with mounting method.
ADC22 has probably a wrongly mounted chip within package.
(simply behaving strange).
So for deciding about the mounting method we would have to wait until the annual drift is below 1-2ppm/year and then see the rF changes between summer / winter.
What I plan is to build some ADCs with (new) AD586 to compare.
But I can´t remember that any of my AD586 ever had drifts in the 8ppm/kHr range.
The dead bug type of mounting could result in higher thermal resistance and thus higher temperature from the 15 mA burn in procedure. Especially the jumps in the curve don't look that good.
I did not consider the higher thermal resistance up to now. But this should make less than a factor of 2 in effects.
As already said: Those jumps are most probably something strange with the (individual) chip itself or the mounting within LS8-package.
I am convinced that the LS8-package is not a good replacement for the CERDIP nor the metal can package.
with best regards
Andreas