Mechanical and thermal stresses play havoc with all references. My plan, as yet unrealized, is to space the device upside down and dead-bug the wiring with fine constantan or manganin. The device is small so the wires should support it just fine. Using ABC (anything but copper) will reduce the thermal flow out of the part and probably increase the stability and lower the power requirements. I'm guessing the added resistance of the wiring will be a constant and not affect anything, but that remains to be seen, depending on the current flow for heating.