I promise to share my data.
But first i need to build the KX-REF. ( and bring my meters into a trusting condition... )
I have some questions regarding the fabrication of the board.
allpcb.com is asking for details that i cannot give....
So far i chose :
Layers : 4
Thickness : 1.6 ( other options 0.2, 0.4, 0.6, 0.8, 1.0, 1.2, 2.0, 2.4, 3.0 )
Solder Mask : red
Silkscreen : white
Surface Finish : Immersion Gold
Now the rest that i can only guess :
Min spacing : 5/5 mil ; 6/6 mil ( 6/6 is the default )
Min Hole Size : 0.25 mm ; 0.3 mm ( 0.3 is default ; do we need smaller Holes ? )
Immersion Gold thickness : 1u" ; 2u" ( 1u" is default ; is that u" a micro-inch, a thousandth of an inch ? )
Golden Finger Beveling : yes ; no ( *Both sides bevelling with 35°?Same treatment with chosen Surface Finish )
Via Process : Tenting Vias ; Vias not covered ; plugged vias ( Tenting vias is default )
Finished Copper : 1oz ; 2oz ( 1oz is default )
I would appreciate some help here...
Thank you very much
Joerg