The ADR1399 datasheet revision 0 (not the new datasheet listing the LCC package, which I am yet to read) has the following statement listed under "Thermal Resistance" on page 4 of 11 which may be missing in the new revision :-
"To reduce heater power, avoid bringing power planes close to the device except on the bottom of the PCB, and use a mesh ground instead of a solid plane.
In addition, mounting the device at the full height of its leads, approximately 1cm above the PCB surface reduces the heater power."
Does that put an end to the long/short leads debate[5]?
The LCC package is an attractive option. I guess mechanical relief slots, and edge of board location[3, 4] come into play, or dead-bug style[1, 2], which looks promising :-).
References[1]
ADC20 is built with a hermetic LS8 package mounted dead bug style in a PCB cutout to avoid PCB stress.
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The LS8 hermetically package shows +/-14 = 28uV or 8 ppm hysteresis.
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With best regards
Andreas
[2]
I have a small pcb with a voltage vref LTC6655B. Unfortunately, the long-term drift specified only for LS8 is 20ppm/sqr(1000) ... I have MSOP package though.
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it has a reason why the (typical) drift is only specified for the hermetically package.
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The LS8 package is better, but only if you mount it dead bug style on the PCB so that there is no influence from the PCB.
With best regards
Andreas
[3]
https://www.eevblog.com/forum/metrology/slot-holes-around-ltz1000(a)/msg1531931/#msg1531931
[4] That App Note that discusses mechanical relief which was quoted long in the past ...
[5]
I once investigated LM399 with short and long leads with and without slots.
-branadic-
Edits 1. : Add some references, dead-bug bit.