If those are ENIG pads (looks like, but color is tricky in photos and could be copper+OSP?) then the board probably isn't the problem.
All of the pads with poor wetting look to be attached to copper pours, so that's a big hint. It looks like the heavy thermal mass of those pours is keeping the pads from getting up to temperature. You might be able to improve things by adjusting your reflow profile (more soak time, or more time in the reflow region?), or you might need to increase the thermal isolation of the pads from the pours (fewer spokes, or thinner/longer spokes). The issue could also be compounded by surrounding placement, for example if there are lots of large/heavy components around these joints, those could also make it harder to get these pads up to temperature. The other issues that have been mentioned (like bad solder paste) could be compounding the problem, but I don't think are the main cause.