The stencil does have a bit of spring to it so that even taping it on all four sides means it's not resting all the way flat. I could probably try some stronger tape (like gaffer tape) to keep it it stretched first.
How are people doing the "hold the stencil down in place" idea? I have five fingers to apply pressure and that's not all that uniform...
My boards are 100 x 75mm.
* I surround the PCB with off-cast boards from previous projects. I leave one gap so that I can get to one side after stenciling and lift it out.
* I get stencils at about 15 x 15 cm from JLCPCB.
* I then tape it on the side where I want the most accuracy - using masking tape. This is the end from which I wipe the solder.
* I make sure the paste is to temperature at 20-25C and mixed through, this will take time.
* I clean each board and let it dry.
* I then place the paste on my credit card (all expense spared); and push it down onto the stencil at the preferred end of the board.
* Carefully drag the paste at 45 deg. until well past the last hole. Try hard to do this on one pass - it makes a big difference.
* Putting in 3 fiducials on the board and having them etched through on the stencil will help loads in making sure your paste goes where it needs to.
* When lifting out each board, bring the stencil back in one motion and have something to hold the stencil off the work surface at the very edge so as not to smudge any leftover solder paste.
* And then as mentioned above practice. It's easier and cheaper to put down paste and then clean it off than have to do a lot of re-work post solder reflow.
Go for it.