In my experience I found that having proper solder stops between pins of 0.5 and 0.4 mm pitch QFNs drastically reduces chances of getting bridges. But so far I've found that only one fab that is able to
consistently manufacture ultra-narrow solder stops that don't come off if you accidentally touch it, while not breaking the bank in the process - ourpcb.com . Here is an example of 0.1 mm wide solder stops manufactured properly for 0.4 mm pitch QFN:
Their marketing focus seems to be the quality, so they don't seem to be interested in competing with cheap-ass manufacturers, as a result the boards will come out somewhat more expensive than typical "$5/10 boards" fab, but this is where you have to decide if much higher quality (and somewhat longer lead time) is something you're willing to pay for.
Another factor is solder paste printing quality. if solder paste is dispensed uniformly and there are solder stops, chance of getting a bridge is very small. But this usually require using flamed stencils, or some kind of jig to hold frameless stencil in place and firmly pressed to the board during printing. If you do it all in a "hobbyist-like" fashion, there will most likely be issues with uniformity.
Now, from practical standpoint, bridges between outer pins of QFN is not the end of the world, as you can easily fix them by using a lot of liquid flux and soldering iron, so for prototyping - as long as there are no bridges between exposed pad and outer pins - it's not that big of a concern, even if somewhat annoying - and reliable solder stops will help with this as well. I found it somewhat ironic, but I'm yet to encounter a soldering problem of BGA packages, while I still do get solder bridges on QFNs every once in a while despite my best efforts.