I have had problems with large, heavy parts slipping on the nozzle during the vision gauging of the parts on my P&P machine. When I detected that, I went and selected to use a larger diameter nozzle, and that prevented the issue.
Hmm, no marks in the paste? That may indicate the machine has the wrong component height, and is not putting it all the way down to the board. Try reducing the height that the machine has been given, then it should bring it down more onto the paste.
Also, a problem that has been driving me a bit crazy is very small, light parts bouncing after perfect placement. The symptom I see is badly placed parts, wildly off position, with perfect dimples where the leads were pressed down into the solder paste. This proves the part was initially correctly placed. I think the issue is that the vacuum/blow off timing for these parts is not correct. There's a page in the software where you can set these timings for each footprint, and I just have to find the ideal numbers. This machine is a Quad QSA30A, basically a Samsung CP30 with Quad alignment cameras and Quad electronic feeders.
I'm pretty sure the issue is the nozzle lifts too soon after placing the part, before the vacuum has completely gone away, and that causes the part to lift off the board and the drop off the nozzle.
Not asking for help with this, I know I just have to try a few different settings.
Jon