I'm trying to reflow some PCBs in my diy toaster/reflow oven. I've installed a temperature control module, see below, but I think the temperature might by higher than indicated, as the silkscreen turned brown and there's a bubble looking thing in the solder mask. Another issue is some of the components have moved to the vias, 0603 and 0805, I assume this could be caused by poor/messy placement? Another issue is probably that these aren't my final components, but I wanted to test first without £25 worth of stuff, so I scraped some off an old pcb I had lying around. Kind of glad I did.
I'm using sn67 and I went to a peak of 210 indicated, took 9mins to reach, then cooled down to 170 before opening to cool faster. Thermocouple in poking in the side, horizontal center, slightly above vertical center, maybe 2 centimetres in.
Any advice before I try again, 8 fails left with test components :S.
Images attached.