For BGA reflow, and generally for prototype-scale reflow I really like to just use one of those chinese smartphone repair hotplates. No matter if I have very fragile chipscale packages (back-thinned CCD for example), huge inductors, IMS PCB. Use leaded paste, put your pcb on the hotplate preheated to 50°C, heat the plate up to 220°C, remove PCB. Very reliable, never had a solder failure, never overheated a board.