Good day,
Indeed, the Hirose statement and x/y tolerance requirements for dual connector use is very important... well... at least to me. I mentioned this to the RPi moderators and it was played down big time:
a. Lots of people are using these connectors with "no issues" (ahem) and so it is just me I guess...despite the warning provided by the connector manufacturer.
b. The Hirose statement, etc came out after they designed in and used the connectors and the arrangement
c. It is not a big deal to hand place this components... yeah right... I have been soldering PCBs since I was eight and so almost 50 years and have some higher end gear and experience and it is not a trivial task. Can it be done? Sure, but if I am building a number of devices, spending a lot of time hand soldering ... or having poor yields on assembled boards is an issue for me.
Now, to be fair... Rpi never designed their products for use in industries outside of Educational use and so their internal experience in other markets is probably limited. However, the CM4 and other modules are marketed towards applications and industries outside of Educational use and so one would think that simply talking to a few people in the industries intended may have been prudent? Secondly, we all make mistakes and so why double down and defend a poor design decision and simply offer a newer rev that uses connectors that use an alignment pin? If anything provide a heads up to those that the current design can have assembly issues and so plan accordingly.
Given the attitude and demeanor of the Rpi support moderators, I am wondering what other design issues potentially lurk. Indeed, in general the Rpi's, have been quite reliable once you deal with the SDCard issue, etc and so based upon this empirical data the Rpi stuff could be perfectly fine. However, if the application is sensitive to failure/issues, then one really should test the crap out of the unit and/or look for another solution. On m side I am going with the latter, as the risk of connector contact fatigue (do to a slight misalignment) and low assembly yields is too much and so I using and designing a different solution that is better suited to me needs. My cost will be certainly more... but I am in full control of the design and have a single board that addresses all of my I/O needs, along with a form factor that is better suited towards my applications.
Cheers,
Sam