The standard method is to find a profile that broadly meets the requirements of every part on the board, so melts your solder, stays beneath the peak temp of of parts and keeps the times at key temperatures to specification. A radio module might require a bit more energy but a peak reflow of 250C is in fact 10C lower than you will see for many generic parts. On complex designs you might shield delicate parts to protect them somewhat from the heat required to reflow other parts of the board, flex circuits are an area this is commonly required.
Conventional convection based ovens go to great lengths to reduce the amount of heat transfer via IR, by contrast small desktop ovens are often entirely IR, it works fine for some stuff and is terrible for others. If you put white plastic connectors in an IR oven, they will go at least a little brown for the reasons Deku Tree mentions. However if you can create a profile that peaks far lower (235-240 should be plenty good enough) but still solders your radio module on, it might go less brown.
The smaller your oven is the more difficult it becomes to reflow larger items in the 4-6 minute window specified by your paste, that can mean you need quite high oven temps to get the energy transfer required. With IR ovens that can end up being pretty fierce,push buttons, connectors and leds will be the first to show the signs.