I've posted some photos of one of my boards I've reflowed in my T-962 (just the baseline, not "A" model) here:
https://www.eevblog.com/forum/eda/avoid-pcbway-they-are-scammers/msg1277998/#msg1277998I used leaded solder paste for both sides, and ran the reflow twice - first for the bottom side, then put a board on a standoffs made from some screws and nuts to provide clearance, and ran the reflow of the top side. Even big 1210 caps on the bottom stayed in place and didn't fall. I also did some reflow using LF paste (the board was less complex though, but still had some 7x7 mm QFNs).
If I will remember, I will post a photos of the reflow profiles that I use. Both leaded and LF pastes are of MgChemicals brand (because I prefer buying local if there is an opportunity, and this way I know where to go complain should that become necessary). It was a bit of a trial-and-error process, for which I've bought a bunch of cheapest QFN parts I could find (can't remember now what exactly it was), threw in some assorted passives that I didn't mind losing if something will go wrong, and did several test reflows. Recently as I started using BGAs, I've used several BGA SPI Flash ICs to further tune the process. The advantage of using these exact ICs is that they are in 1.0 mm pitch BGA package, and the pinout is such that you can route it out on 2-layer board. And they are not that expensive unless you plan to ruin hundreds of those - the test board is also designed as a breakout so I can potentially reuse these boards in some projects.
So far I have burnt exactly one part - Molex 2x7x2mm connector - and that was because I didn't bother reading it's datasheet before stuffing it into the oven. And even that one I was able to still use (see photo above).