I'd like to know how you remove SOICs/TSSOPs/SOTs? My method is terrible.
What's your method? I just blast the components away with an el cheapo Duratool hot air station. There really isn't anything to it, except maybe adjusting the right temperature/airflow for your particular nozzle.
Passives and small transistors pretty quickly blast off. If it's an IC I do a circular motion around pads, they either fly away as well or you gently help them with tweezers.
The problem is keeping the other nearby parts from desoldering and plastic connectors from melting. I try to shield them with copper tape. That's why hot tweezers are interesting as you can basically just go and pluck out the component you want.
As far as passives go, again my method may be not ideal, I put some flux down, place the passive then introduce solder using a fine tip. Usually the heating of the flux which causes surface tension keeps the passive in place while that one end gets soldered.
What kind of flux are you using, gel? I only used liquid flux with a pen dispenser so far. I put a bit of flux, pick up the passive, try to place it with tweezers, oops it flipped upside down, try to turn it around, then go get the soldering iron, by that time the part moved again, put iron back, replace part, get iron, try to hold part with a tweezer with one hand, hold solder with a second hand and hold the iron with a... oops ran out of hands. Put some solder on iron tip, touch the part while holding it with a tweezer, part gets soldered to one pad but lifts a bit, then do the other pad. Isn't this how NASA does it?
Is it possible using hot tweezers to put some flux, place the part with regular tweezers, hold solder with one hand, grab the hot tweezers with the other hand and solder the part flat?