Never, EVER encapsulate bond wires like that.
One slight drop and the whole glue setup will shift by an imperceptible amount, shearing the extremely fragile wires right off the die, and possibly the board.
It has to either be very soft selastic, or the whole device has to be encapsulated(through and around the board, around the sensor) with very rigid epoxy(like the one SMD ICs are covered in), to ensure no movement can occur.
Also, your glue may be conductive, and the UV light, if reflected into the sensor, could have severely damaged the ROIC and pixels themselves, because MEMS.
Send me your dead seeks, maybe I'll find a use for them
![Grin ;D](https://www.eevblog.com/forum/Smileys/default/xgrin.gif.pagespeed.ic.QVVz6XIT20.png)