These are a few of the different tips I (ve) use(d) for many years -
To start - the multi-pin tips (there are a few types), just basically just "load" the tip with solder, and wipe it along the pins. That's all. Surface tension etc "pulls" the exact amount of solder to each pin as you "wipe". Naturally, it does rely on solder mask present between the pins (=normally).
Even if not, if there is enough gap, most pins will wet fine. If you get a bridge, just re-run it, and it will clean up. Always best to apply flux first though. You can zoom through ICs, no matter how fine pitch, very easily.
The flat blade tips you see, I use for DIL / SMD removal. Single side at a time mode - I apply flux and / or extra solder along the first side, if the joints are "dry", then just drop the tip along the side and "pop" that side up with tweezers. (holding it at the pins for max leverage). Doesn't need to come up much. The do the other side. I have also used these to "wipe solder" all pins, when I had a lot to do. Minor cleanups after.
I actually find this method MUCH faster and safer than using my myriad hot air guns / tips, which sometimes need to "cook" the pins for many seconds, and STILL may lift a track (on very fine pitches). IF I have several ICs, or other "trickier" cases, I use the tweezer handpiece (2 sizes), with 2 of these tips. Just make sure you have enough flux and solder - it's easy to clean up after.
For quad packs, I often STILL use the tweezer set - flood all 4 sides, melt 2x sides quickly and pop up with tweezers. You have 2-3 secs at least, before one set of sides cools again. I can do several QFPs in a few seconds at a time.
The mini-spoon tip is usually ALL I use for for both types of packages you mention. That QFP tip you show, looks like the DE-solder tips I have for the JBC de-solderer. In all cases, I "tag" one of each corner first, with an ultra-fine tip first - to LOCK it in place, then use the flow tips. That way, you can't mis-align / push the IC off registration.
Having a very large variety of tips / sizes, pretty much assures me that there is NO job I can't solder / de-solder efficiently. Let me know if you have any other particular questions.
Edit: You run the "pool" of solder (held in the tip) along the boundary between the pc pins and the pcb. Each pin will "pull" the exact amount it needs.