I did a very simple setup with an induction hotplate, a thick steel disc (1cm), and a thinner (0.5cm) aluminum disc on top.
I use induction because it has less inertia than regular hotplates and also it heats faster, and the temperature on the heated plate (my steel disc) is very well spread.
For reflow I start the plate, and I check the temperature with a small surface k-probe on the aluminum disc. When I hit profile top temperature on the alu disc, I move the alu disc to the side with clamps and I let it cool under my solder fume aspiration fan.
This worked perfectly well. I just did a few tries with few test boards to calibrate the profile, basically at what temperature I need to move the thing aside and what power to set on the hot plate. Now it's a manual process, but I don't think I need to automate it (it takes only a few minutes and I like being able to visually inspect that big pads like connectors are properly reflowed).
For some reason I though the profile would be very hard to get right, but the alu disc is very good at spreading the temperature evenly, and I was surprised how well the heat moves to the PCB. Also the induction plate can control the temperature with ease. For example, if I am like 20° too low, I step the power up and in about 5 sec I got my 20°C.